মানপিসিবি is made in the most standard and most widely used configuration. These পিসিবিs are usually made of FR4 substrates with a standard thickness of about 1.5mm. পিসিবি substrate materials are poor conductors, so they have copper layer lamination, solder mask and screen printing to make them conductive. These can be single-sided, double-sided or multilayer boards. The heat resistance and high temperature resistance of most FR4 boards are not high, so direct exposure to high temperatures must be avoided. They have heat sinks or copper-filled through holes to prevent heat from entering the circuit. You can avoid using standard পিসিবিs and instead choose aluminum পিসিবিs where high temperatures are not required to operate in extremely high temperature environments. However, if your application requirements are relatively stable, then you can choose a glass fiber standard পিসিবি that is both efficient and economical.